The Corvallis chip startup raised $10 million to advance extreme ultraviolet engineering.
Intel and many other chipmakers and semiconductor equipment manufacturers are awaiting the arrival of a long-awaited production tool called extreme ultraviolet (EUV) that will improve the lithography used to imprint features onto a chip. Lithography is a key step in semiconductor manufacturing, putting tiny patterns onto a chip with ultraviolet light
Corvallis-based Inpria is pioneering new materials engineered specifically for EUV, which the 20-person company says will improve results. Inpria, which spun out of Oregon State University in 2007, announced Tuesday it has raised a second $10 million investment to further its work.
A firm called Air Liquide Venture Capital led Tuesday’s round, backed by the investment arms of chipmaking giants Intel and Samsung, each of whom had previously backed Inpria. Equipment maker Tokyo Okha Kogyo also contributed.
(READ MORE: Oregon Live)
